Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11637024 | Method for glob top encapsulation using molding tape with elevated sidewall | Wiwat Tanwongwan, Nathapop Lappanitpullpol | 2023-04-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11637024 | Method for glob top encapsulation using molding tape with elevated sidewall | Wiwat Tanwongwan, Nathapop Lappanitpullpol | 2023-04-25 |