Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798923 | Staggered dual-side multi-chip interconnect | Shuo Zhang, Eric Zhu, Michael Zhai, Town Zhang, Jie Ma | 2023-10-24 |
| 11616019 | Semiconductor assembly | Jacky Qiu, Martin Ding, Jerry Zhou | 2023-03-28 |