Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11699590 | Copper electrodeposition sequence for the filling of cobalt lined features | Jeyavel Velmurugan, Bryan L. Buckalew | 2023-07-11 |
| 11542630 | Cleaning electroplating substrate holders using reverse current deplating | Lee Peng Chua, Steven T. Mayer, Santosh Kumar | 2023-01-03 |