Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11617285 | Hardened, telecommunications clamshell platform with heat load sharing between both halves of the platform | Simon J. E. Shearman, Michael Bishop, Chander Prakash Gupta | 2023-03-28 |