Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11839936 | Sheet for sintering bonding and sheet for sintering bonding with base material | Ryota Mita | 2023-12-12 |
| 11791302 | Thermosetting sheet, dicing die bonding film, and semiconductor apparatus | Rena Kojima | 2023-10-17 |
| 11697567 | Wound body of sheet for sintering bonding with base material | Ryota Mita | 2023-07-11 |
| 11676936 | Manufacturing method for semiconductor device | Ryota Mita | 2023-06-13 |
| 11594513 | Manufacturing method for semiconductor device | Ryota Mita | 2023-02-28 |