Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11819900 | Sequential molding tool | Hirotaka Miwa, Hidenori Watanabe, Toshikazu Nanbu | 2023-11-21 |
| 11623262 | Method for incrementally forming | Hirotaka Miwa, Shigeyuki Nakagawa, Ryou Murakami | 2023-04-11 |