Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11856695 | Method for forming through-hole, and substrate for flexible printed wiring board | Toshihiro Higashira | 2023-12-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11856695 | Method for forming through-hole, and substrate for flexible printed wiring board | Toshihiro Higashira | 2023-12-26 |