Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11752556 | Lamination shaping copper powder and laminated and shaped product | Yoshito Nishizawa, Takeshi Maruyama, Hiroaki Okubo | 2023-09-12 |
| 11667991 | Lamination shaping copper powder and laminated and shaped product | Yoshito Nishizawa, Takeshi Maruyama, Hiroaki Okubo | 2023-06-06 |
| 11644397 | Lamination shaping powder evaluation method and lamination shaping powder therefor | Seiichi Matsumoto, Motonori Nishida | 2023-05-09 |