Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11695387 | Air gap type semiconductor device package structure and fabrication method thereof | Yunxiang Di, Mengbin Liu | 2023-07-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11695387 | Air gap type semiconductor device package structure and fabrication method thereof | Yunxiang Di, Mengbin Liu | 2023-07-04 |