Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11649379 | Adhesion method, adhesion-structure, and adhesion kit | Kenichi Okada, Koji Akazawa | 2023-05-16 |
| 11593420 | Similarity calculation apparatus, recording medium, and similarity calculation method | Koki UMEHARA, Kiyotaka Kasubuchi, Kiyotaka MIYAI, Kazuhiro Kitamura, Manri TERADA | 2023-02-28 |