Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11677211 | Semiconductor device, semiconductor device package, and manufacturing methods thereof | Takuya Hashimoto, Eiichiro Okahisa, Katsuya Nakazawa, Sumio Uehara, Suguru Kobayashi +1 more | 2023-06-13 |