Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817360 | Chip scale package semiconductor device and method of manufacture | Loh Choong Keat, Weng Khoon Mong | 2023-11-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817360 | Chip scale package semiconductor device and method of manufacture | Loh Choong Keat, Weng Khoon Mong | 2023-11-14 |