Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11720726 | Systems and methods of simulating drop shock reliability of solder joints with a multi-scale model | Cheng-Tang Wu, Wei-Shan Hu, Dandan Lyu, Siddharth Shah | 2023-08-08 |