Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11768166 | System and method for measuring void fraction of inside of heat conduction member | Chen Sun, Yu-Hsiang Liu | 2023-09-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11768166 | System and method for measuring void fraction of inside of heat conduction member | Chen Sun, Yu-Hsiang Liu | 2023-09-26 |