Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848353 | Method of fabricating semiconductor structure | Ching-Chia Huang | 2023-12-19 |
| 11818876 | Method of manufacturing semiconductor device having reduced contact resistance between access transistors and conductive features | — | 2023-11-14 |
| 11677008 | Method for preparing semiconductor device with T-shaped buried gate electrode | Ching-Chia Huang | 2023-06-13 |
| 11647623 | Method for manufacturing semiconductor structure with buried power line and buried signal line | Chiang-Lin Shih, Jeng-Ping Lin | 2023-05-09 |
| 11605718 | Method for preparing semiconductor structure having buried gate electrode with protruding member | — | 2023-03-14 |