Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742242 | Method for manufacturing through-silicon via with liner | Shing-Yih Shih | 2023-08-29 |
| 11610996 | Semiconductor structure and method of forming the same | Chung-Hsun Huang | 2023-03-21 |