Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11847467 | Boot method for embedded system including first and second baseboard management controller (BMC) and operating system (OS) image file using shared non-volatile memory module | Yu-Shu Yeh, Heng-Chia Hsu, Chen-Yin Lin, Chin-Hung Tan | 2023-12-19 |
| 11676886 | Integrated circuit package structure with conductive stair structure and method of manufacturing thereof | Hsih-Yang Chiu | 2023-06-13 |
| 11651896 | Method of manufacturing capacitor structure and capacitor structure | Hsih-Yang Chiu | 2023-05-16 |