Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11760870 | Resin composition for encapsulation | Takashi Hiraoka | 2023-09-19 |
| 11718770 | Curable resin composition and curable sheet | Takayuki Hashimoto, Eiichi Nomura, Katsushi Kan, Daisuke Mori, Yukio Yada +2 more | 2023-08-08 |
| 11660788 | Method for producing sealed structure | — | 2023-05-30 |
| 11608435 | Epoxy resin composition, electronic component mounting structure, and method for producing the same | Yasuhito Fujii, Katsushi Kan | 2023-03-21 |