Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11552020 | Semiconductor composite device and package board used therein | Koshi HIMEDA, Tatsuya Kitamura, Chiharu Sakaki, Shinya Kiyono, Sho Fujita +4 more | 2023-01-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11552020 | Semiconductor composite device and package board used therein | Koshi HIMEDA, Tatsuya Kitamura, Chiharu Sakaki, Shinya Kiyono, Sho Fujita +4 more | 2023-01-10 |