Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824001 | Integrated circuit package structure and integrated circuit package unit | Yingjiang Pu, Xiuhong Guo | 2023-11-21 |
| 11670600 | Panel level metal wall grids array for integrated circuit packaging | Yingjiang Pu, Xiuhong Guo | 2023-06-06 |
| 11652029 | 3-D package structure for isolated power module and the method thereof | Jian Jiang, Di Han | 2023-05-16 |
| 11616017 | Integrated circuit package structure, integrated circuit package unit and associated packaging method | Yingjiang Pu, Xiuhong Guo | 2023-03-28 |