Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11646285 | Semiconductor package using core material for reverse reflow | Jae Yeol SON, Jae Hun Song, Young Woo Lee, Seul Gi LEE, Min Su Park +1 more | 2023-05-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11646285 | Semiconductor package using core material for reverse reflow | Jae Yeol SON, Jae Hun Song, Young Woo Lee, Seul Gi LEE, Min Su Park +1 more | 2023-05-09 |