Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11569141 | Semiconductor device including a groove within a resin insulating part positioned between and covering parts of a first electrode and a second electrode | Daisuke Oya, Tetsuo Motomiya | 2023-01-31 |