Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11760074 | Mold for prepreg lamination and prepreg lamination method | Kazuki ISHIDA, Masahiko Shimizu, Kohei MUTO, Akihito Suzuki, Kenji Murakami | 2023-09-19 |
| 11738961 | Splice device, and composite material automated lamination device | Akihito Suzuki, Kazuki ISHIDA, Kohei MUTO, Kenji Murakami, Makoto INOMOTO | 2023-08-29 |