Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824048 | Power semiconductor module and composite module having peripheral structures surrounding parts of the module main body | Tetsuya Matsuda | 2023-11-21 |
| 11705424 | Spring electrode for press-pack power semiconductor module | Tetsuya Matsuda | 2023-07-18 |