HH

Hiroaki Haruna

Mitsubishi Electric: 1 patents #552 of 2,113Top 30%
Overall (2023): #425,489 of 537,848Top 80%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11842968 Power semiconductor device and substrate with dimple region Kohei YABUTA, Takayuki Yamada, Yuya Muramatsu, Noriyuki Besshi, Yutaro Sugi +2 more 2023-12-12