Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11834603 | Heat dissipation sheet, heat dissipation member, and semiconductor device | Toshiyuki Tanaka, Akira Watanabe, Katsuhiko Hidaka | 2023-12-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11834603 | Heat dissipation sheet, heat dissipation member, and semiconductor device | Toshiyuki Tanaka, Akira Watanabe, Katsuhiko Hidaka | 2023-12-05 |