Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11825593 | Through board via heat sink | Kesav Kumar Sridharan, Scott D. Brandenburg | 2023-11-21 |
| 11699012 | Coverage based microelectronic circuit, and method for providing a design of a microelectronic circuit | — | 2023-07-11 |
| 11558039 | Method and arrangement for ensuring valid data at a second stage of a digital register circuit | — | 2023-01-17 |