BL

Brian Leung

IN Intel: 1 patents #1,763 of 4,378Top 45%
📍 Kowloon, MA: #1 of 1 inventorsTop 100%
Overall (2023): #500,621 of 537,848Top 95%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11656662 Layered super-reticle computing : architectures and methods Simon C. Steely, Jr., Richard J. Dischler, David Bach, Olivier Franza, William J. Butera +2 more 2023-05-23