Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11594525 | Packaged integrated circuit devices with through-body conductive vias, and methods of making same | Tongbi Jiang | 2023-02-28 |
YC
Yong Poo Chia
Overall (2023): #195,362 of 537,848Top 40%
1
Patents 2023