Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742309 | Bump coplanarity for semiconductor device assembly and methods of manufacturing the same | Tsung-Che Tsai | 2023-08-29 |
KL
Ko Han Lin
Overall (2023): #362,695 of 537,848Top 70%
1
Patents 2023