Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798837 | Methods for forming openings in conductive layers and using the same | Tsuyoshi Tomoyama | 2023-10-24 |
| 11647624 | Apparatuses and methods for controlling structure of bottom electrodes and providing a top-support thereof | Akira Kaneko | 2023-05-09 |