Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11630127 | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties | Ming Ting Wu, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar +2 more | 2023-04-18 |