Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11686624 | Chip wiring layer temperature sensing circuit, temperature sensing method and chip thereof | Bo Wang, Hongfeng Zhu, Jun Hong Yi, Qibin Zhu | 2023-06-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11686624 | Chip wiring layer temperature sensing circuit, temperature sensing method and chip thereof | Bo Wang, Hongfeng Zhu, Jun Hong Yi, Qibin Zhu | 2023-06-27 |