Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749610 | Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chip | Jin-Yuan Lee | 2023-09-05 |
| 11711082 | Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells | Jin-Yuan Lee | 2023-07-25 |
| 11683037 | Logic drive using standard commodity programmable logic IC chips | Jin-Yuan Lee | 2023-06-20 |
| 11651132 | Logic drive based on standard commodity FPGA IC chips | Jin-Yuan Lee | 2023-05-16 |
| 11637056 | 3D chip package based on through-silicon-via interconnection elevator | Jin-Yuan Lee | 2023-04-25 |
| 11625523 | Logic drive based on standard commodity FPGA IC chips | Jin-Yuan Lee | 2023-04-11 |
| 11616046 | Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chip | Jin-Yuan Lee | 2023-03-28 |
| 11600526 | Chip package based on through-silicon-via connector and silicon interconnection bridge | Jin-Yuan Lee | 2023-03-07 |
| 11545477 | Logic drive based on standardized commodity programmable logic semiconductor IC chips | Jin-Yuan Lee | 2023-01-03 |