Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11647600 | Sealed package and method of forming same | Christian S. Nielsen, Rajesh V. Iyer, Gordon O. Munns, Andrew J. Ries | 2023-05-09 |
| 11617892 | Toolless lead connector assembly | Rajesh V. Iyer, Randy S. Roles, Erik R. Scott | 2023-04-04 |
| 11559695 | Implantable medical devices having modular lead bores | Darren A. Janzig, Brad C. Tischendorf, Randy S. Roles, Steven T. Deininger, Nicholas R. Whitehead | 2023-01-24 |