Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854924 | Semiconductor package with improved reliability | Tien-Chang Chang | 2023-12-26 |
| 11705514 | MOS transistor structure with hump-free effect | Cheng-Hua LIN | 2023-07-18 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854924 | Semiconductor package with improved reliability | Tien-Chang Chang | 2023-12-26 |
| 11705514 | MOS transistor structure with hump-free effect | Cheng-Hua LIN | 2023-07-18 |