Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749572 | Testing bonding pads for chiplet systems | Chun-Hsiung Hung | 2023-09-05 |
| 11631441 | Method and system for enhanced multi-address read operations in low pin count interfaces | Kuen-Long Chang, Yung-Feng Lin | 2023-04-18 |
| 11631464 | Memory apparatus and associated control method for reducing erase disturb of non-volatile memory | Kuen-Long Chang | 2023-04-18 |
| 11605431 | Memory device and operation method thereof | Yung-Feng Lin, Teng-Hao Yeh, Hang-Ting Lue | 2023-03-14 |