Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11726942 | Module assembly and multi-master communication method thereof | Seungbae Son | 2023-08-15 |
| 11586180 | Assembly information providing system and module assembly | Seungbae Son, Huijae Park, Sanghun Oh | 2023-02-21 |