Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848257 | Bending semiconductor chip for connection at different vertical levels | Stuart Cardwell | 2023-12-19 |
| 11598745 | Electrochemical gas sensor assembly | Johnny JIAN, Neils Richard Stewart Hansen, Keith Francis Edwin Pratt, Fuxia Liu | 2023-03-07 |