Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804390 | Systems for integrated decomposition and scanning of a semiconducting wafer | Tyler Yost, Daniel R. Wiederin, Beau A. Marth, Jared Kaser, Jonathan Hein +2 more | 2023-10-31 |
| 11734067 | Multi-core system and controlling operation of the same | Byungchul Jeon, Junho Huh | 2023-08-22 |
| 11705351 | Systems for integrated decomposition and scanning of a semiconducting wafer | Tyler Yost, Daniel R. Wiederin, Beau A. Marth, Jared Kaser, Jonathan Hein +2 more | 2023-07-18 |
| 11694914 | Systems for integrated decomposition and scanning of a semiconducting wafer | Tyler Yost, Daniel R. Wiederin, Beau A. Marth, Jared Kaser, Jonathan Hein +2 more | 2023-07-04 |
| 11687696 | Semiconductor design automation system and computing system including the same | Song Han, Jae-Ho Kim, Ji-Seong Doh, Kang-Hyun Baek, Young Kyou Shin +3 more | 2023-06-27 |
| 11591691 | Method of forming a thin film using a surface protection material | Geun Su Lee, Ha Na Kim, Woong Jin CHOI, Eun Ae Jung, Dong Hyun Lee +4 more | 2023-02-28 |