Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11597837 | Thermosetting resin composition for semiconductor package, prepreg and metal clad laminate using the same | Yongseon Hwang, Hwayeon Moon, Hee Yong Shim, Hyunsung Min | 2023-03-07 |