Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670749 | Method for manufacturing light emitting diode packaging structure | Chih-Hao Lin, Jo-Hsiang CHEN, Shih-Lun Lai, Jian Liang | 2023-06-06 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670749 | Method for manufacturing light emitting diode packaging structure | Chih-Hao Lin, Jo-Hsiang CHEN, Shih-Lun Lai, Jian Liang | 2023-06-06 |