Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784459 | Electrical element mounting package, array package, and electrical device | Sentarou YAMAMOTO, Masanori Okamoto, Toshifumi HIGASHI | 2023-10-10 |
| 11778747 | Wiring board, composite substrate, and electric device | Toshifumi HIGASHI, Takafumi Yamaguchi | 2023-10-03 |
| 11757249 | Substrate for mounting a light-emitting element and array substrate, and light-emitting device | — | 2023-09-12 |