Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11856659 | Board-like structure and heater system | Yoshihiro Okawa | 2023-12-26 |
| 11818813 | Wafer-use member, wafer-use system, and method for manufacturing wafer-use member | Yoshihiro Okawa | 2023-11-14 |