Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11615972 | Reusable die catch materials, reusable die release materials, related die transfer systems, and methods of using the same | Tao-Hua Lee, Ting-Chia Huang | 2023-03-28 |
| 11616042 | Methods of bonding of semiconductor elements to substrates, and related bonding systems | Adeel Ahmad Bajwa | 2023-03-28 |