Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11770903 | Method for manufacturing circuit board including metal-containing layer | Ji Young Byun, Honguk Cheon | 2023-09-26 |
| 11753725 | Non-metal member with colored surface and method of coloring non-metal surface | Ji Young Byun, In Uk Baek | 2023-09-12 |