Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11677060 | Method for transferring and bonding of devices | Yong Sung EOM, Gwang-Mun CHOI, Kwang-Seong Choi, Chanmi Lee, Ki Seok Jang | 2023-06-13 |
| 11618109 | Wire for electric bonding | Gwang-Mun CHOI, Yong Sung EOM, Kwang-Seong Choi, Chanmi Lee, Ki Seok Jang | 2023-04-04 |