Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581260 | Package structure and manufacturing method thereof | Chi-Ting Huang, HSIANG-HUA LU, YING-CHIEH PAN | 2023-02-14 |
| 11569195 | Semiconductor packaging structure and method of fabricating same | YOUNG-WAY LIU | 2023-01-31 |