Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11750983 | Microphone assembly with standoffs for die bonding | Tony K. Lim | 2023-09-05 |
| 11696082 | Insert molded or over molded insulating layers on enclosures for microphone assemblies | Lili Borna, Tony K. Lim | 2023-07-04 |
| 11662236 | Sensor package with ingress protection | Tony K. Lim | 2023-05-30 |