Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11551985 | Semiconductor device having a resin layer sealing a plurality of semiconductor chips stacked on first semiconductor chips | Yuki Sugo, Ayana Amano, Takeshi Watanabe | 2023-01-10 |